JPH0228261B2 - - Google Patents
Info
- Publication number
- JPH0228261B2 JPH0228261B2 JP59013719A JP1371984A JPH0228261B2 JP H0228261 B2 JPH0228261 B2 JP H0228261B2 JP 59013719 A JP59013719 A JP 59013719A JP 1371984 A JP1371984 A JP 1371984A JP H0228261 B2 JPH0228261 B2 JP H0228261B2
- Authority
- JP
- Japan
- Prior art keywords
- outer container
- external terminals
- semiconductor device
- insulating substrate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1371984A JPS60157243A (ja) | 1984-01-25 | 1984-01-25 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1371984A JPS60157243A (ja) | 1984-01-25 | 1984-01-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60157243A JPS60157243A (ja) | 1985-08-17 |
| JPH0228261B2 true JPH0228261B2 (en]) | 1990-06-22 |
Family
ID=11841048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1371984A Granted JPS60157243A (ja) | 1984-01-25 | 1984-01-25 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60157243A (en]) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0342685Y2 (en]) * | 1984-10-12 | 1991-09-06 | ||
| JPH0611537Y2 (ja) * | 1989-03-03 | 1994-03-23 | 新電元工業株式会社 | 樹脂封止型電子回路装置 |
| US5285106A (en) * | 1990-01-18 | 1994-02-08 | Kabushiki Kaisha Toshiba | Semiconductor device parts |
| DE19719703C5 (de) * | 1997-05-09 | 2005-11-17 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Leistungshalbleitermodul mit Keramiksubstrat |
| JP5183642B2 (ja) | 2007-12-20 | 2013-04-17 | アイシン・エィ・ダブリュ株式会社 | 半導体装置およびその製造方法 |
| JP6028592B2 (ja) * | 2013-01-25 | 2016-11-16 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5435666B2 (en]) * | 1975-02-11 | 1979-11-05 | ||
| JPS5412386A (en) * | 1977-06-28 | 1979-01-30 | Teijin Ltd | Isocarbostyril derivative |
| JPS5923496B2 (ja) * | 1977-08-25 | 1984-06-02 | 富士通株式会社 | タイミング抽出方式 |
| JPS56145850U (en]) * | 1980-04-02 | 1981-11-04 | ||
| FR2503932A1 (fr) * | 1981-04-08 | 1982-10-15 | Thomson Csf | Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication |
| JPS587346A (ja) * | 1981-07-07 | 1983-01-17 | 株式会社東海理化電機製作所 | プラスチツク積層体 |
-
1984
- 1984-01-25 JP JP1371984A patent/JPS60157243A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60157243A (ja) | 1985-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7122401B2 (en) | Area array type semiconductor package fabrication method | |
| US6261865B1 (en) | Multi chip semiconductor package and method of construction | |
| US5521429A (en) | Surface-mount flat package semiconductor device | |
| JP3425202B2 (ja) | 電子装置パッケージ・アセンブリー | |
| TWI272705B (en) | Heat spreader and package structure utilizing the same | |
| JP2895920B2 (ja) | 半導体装置及びその製造方法 | |
| JPS62202548A (ja) | 半導体装置 | |
| JPH0228261B2 (en]) | ||
| KR102371636B1 (ko) | 양면 기판 반도체 제조 방법 | |
| JPH10335577A (ja) | 半導体装置及びその製造方法 | |
| JPH0418694B2 (en]) | ||
| JPH0661372A (ja) | ハイブリッドｉｃ | |
| JPH10335366A (ja) | 半導体装置 | |
| JPH07176664A (ja) | 半導体装置およびその製造方法 | |
| JP3670371B2 (ja) | 半導体装置およびその製造方法 | |
| KR101008534B1 (ko) | 전력용 반도체모듈패키지 및 그 제조방법 | |
| JPH11260850A (ja) | 半導体装置およびその製造方法 | |
| JP3295987B2 (ja) | 半導体装置の製造方法 | |
| JPH08153826A (ja) | 半導体集積回路装置 | |
| JP2975782B2 (ja) | 混成集積回路装置およびこれに用いるケース材 | |
| KR900001744B1 (ko) | 반도체장치 | |
| JPS6219063B2 (en]) | ||
| KR20030054066A (ko) | 적층 패키지 및 그 제조 방법 | |
| JPS6195539A (ja) | 半導体装置およびその製造方法 | |
| JP4123131B2 (ja) | 半導体装置 |